Effect of drying methods on hybrid layer thickness

Purpose: To evaluate the effect of drying methods used in scanning electron microscopy on the thickness of the hybrid layers created by several different adhesive systems. Methods: A total etch dry bonding system, (Photobond), a three-step bonding adhesive system, (Scotchbond Multi-Purpose), a wet-bonding adhesive system (All-Bond 2) and a self-etching primer system (Mac Bond II) were used in this study. To permit measurement of the thickness of the hybrid layer, the resin-dentin interfaces were polished and etched briefly to remove polishing debris followed by immersion in 10% NaOCl for 4 hours. Half of the specimens in each group were subjected to fixation and critical-point drying followed by gold sputter-coating. The remaining specimens were allowed to air dry prior to gold sputter-coating. SEM observations were carried out to determine the structure and thickness of the hybrid layers. Results: The thickness of hybrid layers were affected by the drying methods with the critical-point drying methods producing the thickest hybrid layers (P< 0.05). The thickest hybrid layers were created by Photobond, with Scotchbond Multi-Purpose and All-Bond 2 producing intermediate thickness hybrid layers, among the total etch systems. The thinnest hybrid layer among all of the adhesive systems was produced by the self-etching primer, Mac Bond II.