The overwet phenomenon: A scanning electron microscopic study of surface moisture in the acid-conditioned, resin-dentin interface
- ,
- A. John Gwinnett(corresponding author),
- Stephen H Y Wei
- The University of Hong Kong,
- Stony Brook University
Abstract
Purpose: To study with the scanning electron microscope the interfacial phenomenon that occurred in the presence of excessive surface moisture following the application of an acetone-based adhesive to acid-conditioned dentin. Materials and Methods: Specimens consisted of flat dentin discs that were divided into three groups based upon the status of remaining surface moisture: (1) 3-second dry group, (2) blot-dry group, with the conditioned dentin surface remaining shiny as opposed to matte, and (3) overwet group: an additional 40 mL of distilled water spread thin on the dentin surface after blot-drying. Polished resin-dentin interfaces were brought into relief using plasma-etching and examined without further embedding. Results: Although a hybrid layer was observed in all three groups, there was (1) a sequential deterioration of the bonded assembly along the hybrid layer-resin interface, and (2) loss of complete tubular seal as the quantity of surface moisture increased. Intratubular resin globules were observed beneath short resin plugs in the 3-second dry group. Small, isolated blister-like spaces, trapped within the resin layer, were observed along the surface of the hybrid layer in the blot-dry group, while similar, but larger spaces were found in the overwet group. The blister-like spaces, which were often continuous with incompletely sealed tubular orifices, were partially filled with extraneous resin globules dispersed within an amorphous matrix.
Publication Information
Output type
Original language
English (US)Pages from-to (Number of pages)
Pages 109-114 (6 pages)Journal (Volume, Issue Number)
American journal of dentistry (Volume 9, Issue 3)Publication milestones
- Published - 1996
Publication status
ISSN
0894-8275Publication IDs
- Scopus: 0030155398
- PubMed: 9002800
