@inproceedings{e7801f139bc84dd98a8ae4b89d0c5b5c,
title = "ECHAIN: Securing Electronic Device Provenance through Privacy-Preserving Consortium Blockchains",
abstract = "A conventional electronic device provenance is vulnerable to several attacks due to the limited traceability of transactions and a lack of unclonable device identities. Although electronic chip identification (ECID) has been suggested to improve security, discussion on ECID data management and users' privacy preservation in such a decentralized device provenance management system is insufficient. In this work, we propose a framework named ECHAIN. The novelties include: (1) it uses uniquely hashed electronic chip identification (ECIDs) to maintain the security of sensitive ECID data; (2) it allows most transactions processed in parallel with a part of blockchain nodes participating to maximize the system efficiency; and (3) it employs ECID-based PKI keyless encryption to protect users' privacy from the blockchain system. A prototype system is implemented and deployed on a 58-node consortium blockchain. Compared with the conventional solutions, experiments show that ECHAIN incurs less than 10% overhead when registering electronic devices while delivering up to 5× higher transaction throughput.",
keywords = "blockchain, counterfeiting, privacy, supplychain",
author = "Abdullah Al-Mamun and Dongfang Zhao",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume, DSN-S 2023 ; Conference date: 27-06-2023 Through 30-06-2023",
year = "2023",
doi = "10.1109/DSN-S58398.2023.00028",
language = "English (US)",
series = "Proceedings - 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume, DSN-S 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "77--83",
booktitle = "Proceedings - 53rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks - Supplemental Volume, DSN-S 2023",
}