Multimodal Sensor System for Pressure Ulcer Wound Assessment and Care

Ming Ching Chang, Ting Yu, Jiajia Luo, Kun Duan, Peter Tu, Yang Zhao, Nandini Nagraj, Vrinda Rajiv, Michael Priebe, Elena Astapova Wood, Maximillian Edward Stachura

Research output: Contribution to journalArticlepeer-review

33 Scopus citations


We present a multimodal sensor system for wound assessment and pressure ulcer care. Multiple imaging modalities including RGB, three- dimensional (3-D) depth, thermal, multispectral, and chemical sensing are integrated into a portable hand-held probe for real-time wound assessment. Analytic and quantitative algorithms for various assessments including tissue composition, wound measurement in 3-D, temperature profiling, spectral, and chemical vapor analysis are developed. After each assessment scan, 3-D models of the wound are generated on the fly for geometric measurement, while multimodal observations are analyzed to estimate healing progress. Collaboration between developers and clinical practitioners was conducted at the Charlie Norwood VA Medical Center for in-field data collection and experimental evaluation. A total of 133 assessment sessions from 23 enrolled subjects were collected, on which the multimodal data were analyzed and validated with respect to clinical notes associated with each subject. The system can be operated by nontechnical caregivers on a regular basis to aid wound assessment and care. A web portal front-end was developed for clinical decision and telehealth support, where all historical patient data including wound measurements and analysis can be organized online.

Original languageEnglish (US)
Pages (from-to)1186-1196
Number of pages11
JournalIEEE Transactions on Industrial Informatics
Issue number3
StatePublished - Mar 2018


  • Chemical vapor sensing
  • RGB+D
  • multimodal sensor system
  • multispectral
  • pressure ulcer
  • telehealth
  • thermal
  • wound assessment

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Information Systems
  • Computer Science Applications
  • Electrical and Electronic Engineering


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